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Brushed Motor Three-Speed Speed Control Rib Gun Massage Gun Circuit Board PCB
Product introduction
NO | Item | Craft Ability |
1 | Surface Finish | HASL,Immersion Gold,Gold Plating,OSP,Immersion Tin,etc |
2 | Layer | 1-32 layers |
3 | Min.Line Width | 4mil |
4 | Min.Line Space | 4mil |
5 | Min.Space between Pad to Pad | 3mil |
6 | Min.Hole Diameter | 0.20mm |
7 | Min.Bonding Pad Diameter | 0.20mm |
8 | Max.Proportion of Drilling Hole and Board Thickness | 1:10 |
9 | Max.Size of Finish Board | 23inch*35inch |
10 | Rang of Finish Board′s Thickness | 0.21-3.2mm |
About our Advantages:
1.Professional Surface-mounting and Through-hole soldering Technology
2. Various sizes like 1206,0805,0603 ,0402,0201 components SMT technology
3.ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4.PCB Assembly With UL,CE,FCC,Rohs Approval
5.Nitrogen gas reflow soldering technology for SMT.
6.High Standard SMT&Solder Assembly Line
7.High density interconnected board placement technology capacity.
SMT patch processing will purchase components according to BOM, BOM provided by customers and confirm the PMC plan of production. After the preparatory work is completed, we will start SMT programming, manufacture laser steel mesh and solder paste printing according to the SMT process.
The components will be mounted on the circuit board through SMT mounter, and online AOI automatic optical detection will be carried out if necessary. After testing, the perfect reflow furnace temperature curve is set to let the circuit board flow through reflow welding.
After the necessary IPQC inspection, the DIP material can then be passed through the circuit board using the DIP process and then through wave soldering. Then it is time to carry out the necessary post-furnace process.
After all the above processes are completed, QA will conduct a comprehensive test to ensure product quality.
SMT basic process elements include: screen printing (or dispensing), mounting (curing), reflow soldering, cleaning, testing, repair
1. Screen printing: Its function is to leak solder paste or patch glue onto the PCB pad to prepare for the welding of components. The equipment used is screen printing machine (screen printing machine), located at the front end of the SMT line.
2, dispensing: it is to drop the glue to the fixed position of the PCB board, its main role is to fix the components to the PCB board. The equipment used is the dispensing machine, which is located at the front end of the SMT production line or behind the testing equipment.
Why did you choose us?
Focused on PCBA electronic manufacturing for 8 years
Best Partner for Listed Companies
Serving over 60 European and American enterprises
Helping clients solve design issues over 500 times
Helped customers solve MP issues over 800 times.
Helping customers improve testing reliability over 1000 times
ISO9001: 2015
ISO13485
IATF16949
MES
Traceability system
Fully automatic FCT testing
Quick response principle within 1 hour
7 days * 24 hours
Team responsibility system
Sales personnel with a bachelor's degree or above