Product Categories

Custom PCB

[11]

Contact Now

Guangzhou Kaijin Precision Manufaturing Co., Ltd.

City:guangzhou

Country/Region:china

Contact Person:MrRain Kong

View Contact Details

Contact Now

China SMT PCB Assembly And Soldering DIP Video Surveillance Terminal Motherboard wholesale

SMT PCB Assembly And Soldering DIP Video Surveillance Terminal Motherboard

Name: SMT PCB Assembly And Soldering DIP Video Surveillance Terminal Motherboard
Brand: KAIJIN
Price: 1 USD

Ask Latest Price

Video Channel

Brand Name :KAIJIN

Model Number :PCBA

Certification :ISO 9001:2015

Place of Origin :China

MOQ :100+

Payment Terms :L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability :6000

Delivery Time :10

Packaging Details :Fully featured

Processing type :customized

Processing method :any way

Processing equipment :high-speed placement machine, reflow soldering, wave soldering, AI, AOI, X-RAY, etc

Quality certification :standard integration management system, ISO9

Number of processing equipment :50 sets

Number of production lines :5

Daily processing capacity :6 million points

Lead-free manufacturing process :Yes

Contact Now

Add to Cart

View Product Description

SMT Chip Processing DIP Soldering Video Surveillance Terminal Motherboard

Product parameters

Types of Assembly	SMT (Surface-Mount Technology)
	THD (Thru-Hole Device)
	SMT & THD mixed
	Double sided SMT and THD assembly
SMT capability	PCB layer: 1-32 layers;
	PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards;
	Board type: Rigid FR-4, Rigid-Flex boards
	PCB thickness: 0.2mm-7.0mm;
	PCB dimension width: 40-500mm;
	Copper thickness: Min:0.5oz; Max: 4.0oz;
	Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;
	Component size: 0.60.3mm-33.533.5mm;
	Component height: 6mm(max);
	Pin spacing laser recognition over 0.65mm;
	High resolution VCS 0.25mm;
	BGA spherical distance: ≥0.25mm;
	BGA Globe distance: ≥0.25mm;
	BGA ball diameter: ≥0.1mm;
	IC foot distance: ≥0.2mm;

Types of Assembly	SMT (Surface-Mount Technology)
	THD (Thru-Hole Device)
	SMT & THD mixed
	Double sided SMT and THD assembly
SMT capability	PCB layer: 1-32 layers;
	PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards;
	Board type: Rigid FR-4, Rigid-Flex boards
	PCB thickness: 0.2mm-7.0mm;
	PCB dimension width: 40-500mm;
	Copper thickness: Min:0.5oz; Max: 4.0oz;
	Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;
	Component size: 0.60.3mm-33.533.5mm;
	Component height: 6mm(max);
	Pin spacing laser recognition over 0.65mm;
	High resolution VCS 0.25mm;
	BGA spherical distance: ≥0.25mm;
	BGA Globe distance: ≥0.25mm;
	BGA ball diameter: ≥0.1mm;
	IC foot distance: ≥0.2mm;

Types of Assembly	SMT (Surface-Mount Technology)
	THD (Thru-Hole Device)
	SMT & THD mixed
	Double sided SMT and THD assembly
SMT capability	PCB layer: 1-32 layers;
	PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards;
	Board type: Rigid FR-4, Rigid-Flex boards
	PCB thickness: 0.2mm-7.0mm;
	PCB dimension width: 40-500mm;
	Copper thickness: Min:0.5oz; Max: 4.0oz;
	Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;
	Component size: 0.60.3mm-33.533.5mm;
	Component height: 6mm(max);
	Pin spacing laser recognition over 0.65mm;
	High resolution VCS 0.25mm;
	BGA spherical distance: ≥0.25mm;
	BGA Globe distance: ≥0.25mm;
	BGA ball diameter: ≥0.1mm;
	IC foot distance: ≥0.2mm;

Why did you choose us?
1,Experienced
Focused on PCBA electronic manufacturing for 8 years
Best Partner for Listed Companies
Serving over 60 European and American enterprises
Helping clients solve design issues over 500 times
Helped customers solve MP issues over 800 times.
Helping customers improve testing reliability over 1000 times
2,Quality control
ISO9001: 2015
ISO13485
IATF16949
MES
Traceability system
Fully automatic FCT testing
3,Quick response
Quick response principle within 1 hour
7 days * 24 hours
Team responsibility system
Sales personnel with a bachelor's degree or above

Product Tags: