Customized GSM wireless communication module PCB assembly manufacturer
Product parameters
| | SMT (Surface-Mount Technology) |
| THD (Thru-Hole Device) |
| SMT & THD mixed |
| Double sided SMT and THD assembly |
| | PCB layer: 1-32 layers; |
| PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards; |
| Board type: Rigid FR-4, Rigid-Flex boards |
| PCB thickness: 0.2mm-7.0mm; |
| PCB dimension width: 40-500mm; |
| Copper thickness: Min:0.5oz; Max: 4.0oz; |
| Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm; |
| Component size: 0.6*0.3mm-33.5*33.5mm; |
| Component height: 6mm(max); |
| Pin spacing laser recognition over 0.65mm; |
| High resolution VCS 0.25mm; |
| BGA spherical distance: ≥0.25mm; |
| BGA Globe distance: ≥0.25mm; |
| BGA ball diameter: ≥0.1mm; |
| IC foot distance: ≥0.2mm; |
| | SMT (Surface-Mount Technology) |
| THD (Thru-Hole Device) |
| SMT & THD mixed |
| Double sided SMT and THD assembly |
| | PCB layer: 1-32 layers; |
| PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards; |
| Board type: Rigid FR-4, Rigid-Flex boards |
| PCB thickness: 0.2mm-7.0mm; |
| PCB dimension width: 40-500mm; |
| Copper thickness: Min:0.5oz; Max: 4.0oz; |
| Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm; |
| Component size: 0.6*0.3mm-33.5*33.5mm; |
| Component height: 6mm(max); |
| Pin spacing laser recognition over 0.65mm; |
| High resolution VCS 0.25mm; |
| BGA spherical distance: ≥0.25mm; |
| BGA Globe distance: ≥0.25mm; |
| BGA ball diameter: ≥0.1mm; |
| IC foot distance: ≥0.2mm; |
| | SMT (Surface-Mount Technology) |
| THD (Thru-Hole Device) |
| SMT & THD mixed |
| Double sided SMT and THD assembly |
| | PCB layer: 1-32 layers; |
| PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards; |
| Board type: Rigid FR-4, Rigid-Flex boards |
| PCB thickness: 0.2mm-7.0mm; |
| PCB dimension width: 40-500mm; |
| Copper thickness: Min:0.5oz; Max: 4.0oz; |
| Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm; |
| Component size: 0.6*0.3mm-33.5*33.5mm; |
| Component height: 6mm(max); |
| Pin spacing laser recognition over 0.65mm; |
| High resolution VCS 0.25mm; |
| BGA spherical distance: ≥0.25mm; |
| BGA Globe distance: ≥0.25mm; |
| BGA ball diameter: ≥0.1mm; |
| IC foot distance: ≥0.2mm; |
Company Introduction
Guangzhou Kaijin Precision Manufacturing Co., Ltd. is a focus on the electronics industry SMT/DIP high-end circuit board processing, the company has 60 employees, the existing high-speed patch production line four, 3 new YAMAMHA patch lines, a total of 6 machines, 1 SONY patch production line a total of 2 sets, offline AOI inspection equipment 4 sets, daily average patch production capacity of 6 million points, plug-in production lines 2, tin production line 2, new lead-free wave soldering, daily average production capacity of 1.2 million points, Lead-free assembly 30-meter production line 2, daily assembly of about 3,000 products, peripheral auxiliary equipment is perfect, can ensure the integrity of product quality, many places to achieve automated processes, for customers
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